Electronics Solutions for Automated Test Equipment
As semiconductor devices advance, test equipment requires greater stability, accuracy, and reliability. Manufacturers also need flexible, scalable, long-life components that support high throughput and compact test board designs.
OMRON delivers versatile solutions, including G3VM MOSFET relays, signal and high-frequency relays, plus new EFC blade pins for IC testing. These components address challenges in high-frequency, high-power, and high-temperature conditions.
Explore OMRON’s comprehensive solutions for the semiconductor test industry below.
Please select the applicable application below. Omron recommended products for each application will be suggested.
IC test system / IC test handler SOC test system
Memory test system
RF test system Logic handler
Memory handler Resource card
Interface board
Semiconductor wafer test system Automated test equipment
Probing machine
Wafer handler Probe card
Performance board
Resource card
In-circuit tester ICT, Printed circuit board Tester
PCBA tester
Inline In-circuit PCB tester Functional tester
Flying probe tester
Physical layer tester
General tester Electronic measuring instrument
Digital multi meter
Oscilloscope Power analyzer
Signal analyzer
Network analyzer Signal generator
PXI system
DAQ system
Inline test equipment for portable devices and module parts Battery-driven device
Display module
Smart phone
Camera module
Wearable device
Communication module Laptop/Tablet computer
Handheld gaming console
Portable hard drive e-cigarette
Portable Battery
VR Headset

1IC test system
- Relay
- Connector
- Switch
- Micro sensing device


-
- 1Instrument / Interface board
- Test signal switching
MOS FET RelayG3VM series
- Low CxR type
- High-speed response type
- High Temperature Compatible type
- Ultra-Compact type
- High Load Voltage type
- Other types
G6K-RF High frequency compatible(up to 3GHz)
G6K-RF-V High frequency compatible(up to 8GHz)
P6K-08F/08F-Y *Surface-mount terminal-type sockets for PCBs (G6K-2P/G6K(U)-2P-Y)
-
- 2Resource card / interface board
- Signal / power supply connection
MIL connectorsXG2/4/5
Serial communication (i.e.RS232C)
D-sub connectorsXM2/3
- 3Control panel
- Settings
Tactile switchesB3SL/B3FS
- 4Module board
- Board signal change setting
DIP switchesA6TN/A6SN
-
- 5IC handling mechanism
- Toray / PC board detection
Light convergent reflective sensorB5W-LB
- 6Handling mechanism
- Mechanism positioning
Miniature basic switchD3V/SS/D2F
2Semiconductor wafer test system
- Relay
- Connector
- Switch

-
- 1Instrument / Interface board
- Test signal switching
MOS FET RelayG3VM series
- Low CxR type
- High-speed response type
- High Temperature Compatible type
- Ultra-Compact type
- High Load Voltage type
- Other types
G6K-RF High frequency compatible(up to 3GHz)
G6K-RF-V High frequency compatible(up to 8GHz)
P6K-08F/08F-Y *Surface-mount terminal-type sockets for PCBs (G6K-2P/G6K(U)-2P-Y)
-
- 2Resource card / interface board
- Signal / power supply connection
MIL connectorsXG2/4/5
Serial communication (i.e.RS232C)
D-sub connectorsXM2/3
- 3Sensor to board
- Wiring for sensors
e-CON connectorXN2
-
- 4Control panel
- Settings
Tactile switchesB3SL/B3FS
3In-circuit electrical tester
- Relay
- Connector
- Micro sensing device
- Switch

-
- 1Instrument / Interface board
- Test signal switching
MOS FET RelayG3VM series
- Low CxR type
- High-speed response type
- High Temperature Compatible type
- Ultra-Compact type
- High Load Voltage type
- Other types
G6K-RF High frequency compatible(up to 3GHz)
G6K-RF-V High frequency compatible(up to 8GHz)
P6K-08F/08F-Y *Surface-mount terminal-type sockets for PCBs (G6K-2P/G6K(U)-2P-Y)
-
- 2Resource card / interface board
- Signal / power supply connection
MIL connectorsXG2/4/5
Serial communication (i.e.RS232C)
D-sub connectorsXM2/3
- 3Board contacting mechanism
- Mechanism positioning
PhotomicrosensorEE-SX
-
- 4Board contacting mechanism
- Mechanism positioning
Miniature basic switchD3V/SS/D2F
- 5Control panel
- Settings
Tactile switchesB3SL/B3FS
- 6Resource card
- Board signal change setting
DIP switchesA6TN/A6SN
4General Electrical Tester
- Relay
- Connector
- Switch


-
- 1Instrument / Interface board
- Test signal switching
MOS FET RelayG3VM series
- Low CxR type
- High-speed response type
- High Temperature Compatible type
- Ultra-Compact type
- High Load Voltage type
- Other types
G6K-RF High frequency compatible(up to 3GHz)
G6K-RF-V High frequency compatible(up to 8GHz)
P6K-08F/08F-Y *Surface-mount terminal-type sockets for PCBs (G6K-2P/G6K(U)-2P-Y)
-
- 2Resource card / interface board
- Signal / power supply connection
MIL connectorsXG2/4/5
- 3I/O board
- Serial communication (i.e.RS232C)
D-sub connectorsXM2/3
-
- 4Operation panel, I/O board
- Set/reset switching
Tactile switchesB3F/B3FS
Board signal change setting
DIP switchesA6TN/A6SN
5Test equipment for module parts / test equipment for portable devices
- Relay
- Connector




-
- 1Instrument / Interface board
- Test signal switching
MOS FET RelayG3VM series
- Low CxR type
- High-speed response type
- High Temperature Compatible type
- Ultra-Compact type
- High Load Voltage type
- Other types
G6K-RF High frequency compatible(up to 3GHz)
G6K-RF-V High frequency compatible(up to 8GHz)
P6K-08F/08F-Y *Surface-mount terminal-type sockets for PCBs (G6K-2P/G6K(U)-2P-Y)
-
- 2Electrical test process for devices
- Electrical test for final assembly
USB module test socketXP2U
-
- 3I/O board
- Serial communication (i.e.RS232C)
D-sub connectorsXM2/3
- 4Resource card, I/O board
- Signal / power supply connection
MIL connectorsXG2/4/5