The SOLUTIONS - Troubleshoot Case Studies​

This guide helps you understand the cause and solution of malfunction and defect phenomenon.

Describes the unique characteristics of electronic components, malfunction causes and measures, in an easy-to-understand manner.
It can also be used as a preliminary prevention measure and a primary consultation tool when trouble occurs at any time.

A must-have guide for your benefit.

* In case of a malfunction occurring, please return the part(s) to us as is (do not take it/them apart).

MOS FET Relay

MOS FET Relay

Contents

  • MOS FET Relay - Failure Relationship Diagrams
  • MOS FET Relay - Failure Events
  • CASE01 Counter-Electromotive Force
  • CASE02 Voltage Surge (Input Side)
  • CASE03 Ripple voltage
  • CASE04 Inrush Current
  • CASE05 Output Circuit Design Guideline
  • CASE06 Input Circuit Design Guideline
  • Photos of Failure Event

Mechanical PCB Relay Edition

MOS FET Relay

Contents

  • Mechanical Relay Defect Primary Investigation Procedure
  • CASE01 Buzzing and Vibration (AC Only)
  • CASE02 Short Circuit Failure of Diode for Relay Coil Surge Absorber
  • CASE03 Abnormal Heat Generation
  • CASE04 Layer Short Circuit
  • CASE05 Contact Welding
  • CASE06 Contact Sticking (Contact Gluing)
  • CASE07 Operation Failure due to Flux Penetration
  • CASE08 Locking due to Contact Transfer
  • CASE09 Contact Failure due to Carbonization
  • CASE10 Contact Failure due to Silicone
  • CASE11 No Contact Follow
  • CASE12 Contact Failure due to Sulphurization or Chlorination
  • CASE13 Corrosion
  • CASE14 Contact Failure due to the Penetration and Adherence of Foreign Substances (Such as Dust and Insects)
  • CASE15 Burn Damage
  • CASE16 Wear and Deterioration
  • CASE17 Case Holes
  • CASE18 Case Swelling
  • CASE19 Operation Failure due to Seal Leakage
  • Relay Problem Cause Overview

Micro switch

Micro Switch

Contents

  • Miniature Basic Switch
    (V, D3V, VX, D2MV, D2RV)
  • Subminiature Basic Switch
    (D3M, SS, SS-P, D2S)
  • Ultra Subminiature Basic Switch
    (D2LS, D2FS, D2FD, D2F, D2MQ)
  • Sealed Basic Switch
    (D2VW, D2SW, D2SW-P, D2HW, D2JW, D2QW)
  • Detection Switch
    (D2A, D3C, D2X)
  • Reference document

Operation Switch

Operation Switch

Contents

  • Tactile Switch [PCB mounted type]
    (B3F, B3M, B3W, B3WN)
  • Tactile Switch [Surface mounted type]
    (B3FS, B3U, B3S, B3SN, B3SL)
  • Rocker Switch
    (A8L, A8A, A8G, A8GS)
  • DIP Switch
    • Slide DIP Switch
      (A6H, A6HF, A6SH, A6SN, A6T, A6TN, A6D, A6E-N)
    • Piano DIP Switch
      (A6HR, A6SR, A6TR, A6DR, A6FR)
    • Rotary DIP Switch
      (A6K / A6K□, A6R / A6R□, A6A,
      A6C / A6CV)
  • Reference material

Optical Sensor

Optical Sensor

Contents

  • CASE1 Malfunction due to circuit design factors
    (Photomicrosensor)
  • CASE2 Malfunction due to LED open-circuit failure
    (Photomicrosensor)
  • CASE3 Malfunction due to photo IC chip circuit breakage
    (Photomicrosensor)
  • CASE4 Malfunction due to external disturbing light
    (Photomicrosensor)
  • CASE5 Cracks or fractures in sensor case due to physical deterioration
    (Photomicrosensor)
  • CASE6 Element disconnection due to overheating stress
    (Photomicrosensor)
  • CASE7 Conductive error due to discoloration of lead terminals
    (Photomicrosensor)
  • CASE8 Malfunction due to mutual interference
    (Light convergent/diffuse reflective)
  • CASE9 Malfunction due to transparent cover
    (Light convergent/diffuse reflective)
  • CASE10 Malfunction due to tilted shiny object
    (Light convergent reflective)