vol.249 October 2021
![As the PCB becomes smaller: PCBs mounted for higher performance and more functions become possible, The smaller product leads to a reduction in cost of materials, processes, and logistics](/eu-en/sites/components.omron.com.eu/files/2022-07/onboard_249_1_01_en.png)
![Smaller & Thinner](/eu-en/sites/components.omron.com.eu/files/2022-07/onboard_icon_2_10_en.png)
Smaller and thinner board needed.
As industrial equipment is required to have higher performance and more functions, the key is "miniaturization and thinness" of PCBs.
Through the supply of small and thin electronic components, OMRON will promote the miniaturization and thinning of your PCBs and contribute to higher performance and multi-functionality of your products.
01 Significant reduction in mounting footprint
![DIP Package G3VM-21DR→Ultra-compact MOS FET Relay S-VSON Package G3VM-31QR Reduction of footprint by 90%](/eu-en/sites/components.omron.com.eu/files/2022-07/onboard_249_1_02_en.png)
02 Thinner by half
![B3S→Ultra-thin Tactile Switch B3SE Industry's thinnest level*1 *In 1.6 mm square size. According to OMRON's research in September 2021.](/eu-en/sites/components.omron.com.eu/files/2022-07/onboard_249_1_03_en.png)
OMRON's lineup of electronic components contributing to smaller and thinner PCBs
Relay
MOS FET Relay Module G3VM-□MT Series
|
![]() |
---|---|
MOS FET Relay G3VM Series
|
![]() |
Power Relay G6QE
|
![]() |
Switch
Ultra-thin Sealed Surface Mount Tactile Switch B3SE
|
![]() |
---|---|
Sealed Ultra Subminiature Basic Switch D2GW-A
|
![]() |
Sensor
Photomicrosensor SMD Type EE-SX/EE-SY Series
|
![]() |
---|
* Contents as of September 2021.
In the interest of product improvement, specifications are subject to change without notice