vol.288 January 2025

Bringing you the latest information on board design Fresh ON THE BOARD Solutions

Increased heat generation => Heat dissipation Heat suppression

Development / Design Safety / Security
Improved "heat suppression" and "heat dissipation" solve heat problems caused by high capacity.

With the trend towards multifunctionality and high functionality, there is a growing demand for high-capacity support in various types of equipment. However, heat generation issues become more prominent as the capacity becomes higher. A relay generating a large amount of heat can interfere with the functionality of the equipment. Therefore, it is essential to take measures to prevent the relay from generating heat. However, taking countermeasures against heat generation can increase the size of the relay and require additional parts. OMRON contributes to the realization of safety and security with relays that suppress and dissipate heat for higher capacities.

OMRON's relays solve heat problems by adopting heat suppression and dissipation technologies.

If a relay generates a large amount of heat

The improvement of heat suppression and dissipation performance is essential,otherwise it can lead to equipment deterioration and malfunction.
Additional features such as a cooling fan and a heat sink are also required to prevent heat generation.

These additions lead to larger size… higher cost…

Heat suppression
Suppresses resistance of the current-carrying part

Heat suppression by increasing cross-sectional area

Increased cross-sectional area of the current-carrying part
(terminal part)

G6QE

1.2 mm2 × 2 (0.8 × 1.5 mm)
480 VAC, 36 A
Load switching



G6QG

2.4 mm2 × 2 (0.8 × 3.0 mm)
480 VAC, 55 A
Load switching



Supports even larger currents

G9KA

45 mm2 × 2 (3.0 × 15.0 mm)
800 VAC, 260 A
Power interruption



G9KA-E

72 mm2 × 2 (3.0 × 24.0 mm)
1000 VAC, 300 A
Power interruption

Heat suppression
Suppresses resistance of the current-carrying part

Heat suppression by dispersing current

Parallelized contacts to disperse heat without concentrating it

General high-capacity relaysー => G9KA

Heat suppression by improving materials and shape

Optimized contact material and shape to reduce contact resistance

Heat dissipation
Ensures proper ventilation

Heat dissipation by improving ventilation

Improved heat dissipation by adopting a structure that ensures ventilation and by increasing the contact area between each terminal and the air

G9KA

Heat

The G9KA-E with a larger standoff structure allows for even greater ventilation

OMRON's power relays, born from the approach of “heat suppression” and “heat dissipation” improvement

Switchable 480 VAC, 40 A
Low initial contact resistance of 6 mΩ or less
4-pole power relay

G9KC

1-pole 480 VAC, 55 A
Load switchable
Compact, low-profile power relay

NEWG6QG

800 V 260 A / 1000 V 300 A cutoff and ultra-low contact resistance of 0.2 mΩ (initial) or less
High-capacity power relay


G9KA



G9KA-E

The use of heavy copper PCBs further improves heat suppression and dissipation.

Thicker copper foil facilitates current flow, suppresses heat generation, and dissipates heat.

More than 7 times thicker than conventional copper foil


Heavy copper PCBs are effective in various high-capacity relays. If you are considering using heavy copper PCBs, please contact us for technical support.

* Contents as of December 2024.
In the interest of product improvement, specifications are subject to change without notice

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