Solutions for Automated Test Equipment
Semiconductor-based parts are components used in a variety of devices such as smartphones, robots, automobiles, and home electric appliances, which are indispensable for our lives. There are many kinds with different functions, circuits, and structures.
These semiconductor devices are becoming more sophisticated each day, and automated test equipment must be highly accurate and maintain stability to conduct electrical tests to verify the performance, quality and reliability of these devices. The requirements of growing industries for automated test equipment are superior flexibility, scalability, long life, high throughput, minimal maintenance, and downsizing to achieve low cost of testing as well as greater testing reliability.
Omron contributes to higher performance of your test equipment by offering high quality components and innovative products to satisfy your needs.
- IC test system / IC test handler SOC test system
Memory test system
RF test system Logic handler
Memory handler Resource card
Interface board - Semiconductor wafer test system Automated test equipment
Probing machine
Wafer handler Probe card
Performance board
Resource card - In-circuit tester ICT, Printed circuit board Tester
PCBA tester
Inline In-circuit PCB tester Functional tester
Flying probe tester
Physical layer tester - General tester Electronic measuring instrument
Digital multi meter
Oscilloscope Power analyzer
Signal analyzer
Network analyzer Signal generator
PXI system
DAQ system - Inline test equipment for portable devices and module parts Battery-driven device
Display module
Smart phone
Camera module
Wearable device
Communication module Laptop/Tablet computer
Handheld gaming console
Portable hard drive e-cigarette
Portable Battery
VR Headset
01Unique Products for Automated Test Equipment
01-1Extremely low leak current MOS FET relay module G3VM-□MT
- The unique 3-MOS FET structure extremely suppresses
leakage current to DUT.
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Advantages for customers
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- Enhance measurement accuracy.
*Leak current : 1 pA or less - Longer life/Higher reliability operation by switching from reed switches.
- Downsizing with the small module package ( 5mm X 3.75mm X 2.7mm).
- Enhance measurement accuracy.
01-2Long-life test socket for USB module
- Specially developed for in-line testing fixtures for portable devices.
- Available with USB 3.1 type C connector.
- Adopts special electroforming contact pins and unique floating head.
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Advantages for customers
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- Minimal maintenance with a high durability socket.
*High durability: 200K times or more. - Suppress machine stops in the electrical testing process.
*The floating head structure allows an insertion error of testing mechanism. - Hard to damage test products by the plastic tip and the floating head.
- Minimal maintenance with a high durability socket.
01-3SPDT MOS FET relay module G3VM-□M□
- MOS FET relay in module package with SPDT.
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Advantages for customers
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- Design time reduction with the unique SPDT module
- Downsizing with the small footprint package (50 ㎟)
- Longer-life / higher-reliability operation by switching from reed switches
01-48-GHz Band Miniature DPDT relay
- High frequency relay for high-speed differential
transmission signal switching - High frequency characteristics
(insertion loss 3 dB or less at 8 GHz)
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Advantages for customers
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- Improving frequency characteristic by adopting metal case inside relay.
- Downsizing with the miniaturized package ( 11.7mm X 7.9 mm X 7.1mm)
- Energy saving with high sensitivity type (100mW low power consumption)
02Automated Electrical Test Equipment Application Guide
02-1IC test system
- Relay
- Connector
- Switch
- Micro sensing device
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- 1Instrument / Interface board
- Test signal switching
MOS FET RelayG3VM series MOS FET Relay ModuleSPDT moduleG3VM-□M□ T moduleG3VM-□MT Signal RelayG6K/G6J-Y High Frequency RelayUp to 3GHzG6K-RF 8GHzG6K-RF-V
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- 2Resource card / interface board
- Signal / power supply connection
MIL connectorsXG2/4/5 Serial communication (i.e.RS232C)
D-sub connectorsXM2/3
- 3Control panel
- Settings
Tactile switchesB3SL/B3FS
- 4Module board
- Board signal change setting
DIP switchesA6TN/A6SN
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- 5IC handling mechanism
- Toray / PC board detection
Light convergent reflective sensorB5W-LB
- 6Handling mechanism
- Mechanism positioning
Miniature basic switchD3V/SS/D2F
02-2Semiconductor wafer test system
- Relay
- Connector
- Switch
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- 1Instrument / Interface board
- Test signal switching
MOS FET RelayG3VM series MOS FET Relay ModuleSPDT moduleG3VM-□M□ T moduleG3VM-□MT Signal RelayG6K/G6J-Y High Frequency RelayUp to 3GHzG6K-RF 8GHzG6K-RF-V
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- 2Resource card / interface board
- Signal / power supply connection
MIL connectorsXG2/4/5 Serial communication (i.e.RS232C)
D-sub connectorsXM2/3
- 3Sensor to board
- Wiring for sensors
e-CON connectorXN2
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- 4Control panel
- Settings
Tactile switchesB3SL/B3FS
02-3In-circuit electrical tester
- Relay
- Connector
- Micro sensing device
- Switch
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- 1Instrument / Interface board
- Test signal switching
MOS FET RelayG3VM series MOS FET Relay ModuleSPDT moduleG3VM-□M□ T moduleG3VM-□MT Signal RelayG6K/G6J-Y High Frequency RelayUp to 3GHzG6K-RF 8GHzG6K-RF-V
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- 2Resource card / interface board
- Signal / power supply connection
MIL connectorsXG2/4/5 Serial communication (i.e.RS232C)
D-sub connectorsXM2/3
- 3Board contacting mechanism
- Mechanism positioning
PhotomicrosensorEE-SX
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- 4Board contacting mechanism
- Mechanism positioning
Miniature basic switchD3V/SS/D2F
- 5Control panel
- Settings
Tactile switchesB3SL/B3FS
- 6Resource card
- Board signal change setting
DIP switchesA6TN/A6SN
02-4General Electrical Tester
- Relay
- Connector
- Switch
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- 1Switching module/ I/O board
- Test signal switching
MOS FET RelayG3VM series MOS FET Relay ModuleSPDT moduleG3VM-□M□ T moduleG3VM-□MT Signal RelayG6K/G6J-Y High Frequency RelayUp to 3GHzG6K-RF 8GHzG6K-RF-V
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- 2Resource card / interface board
- Signal / power supply connection
MIL connectorsXG2/4/5
- 3I/O board
- Serial communication (i.e.RS232C)
D-sub connectorsXM2/3
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- 4Operation panel, I/O board
- Set/reset switching
Tactile switchesB3F/B3FS Board signal change setting
DIP switchesA6TN/A6SN
02-5Test equipment for module parts / test equipment for portable devices
- Relay
- Connector
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- 1Instrument / Interface board
- Test signal switching
MOS FET RelayG3VM series MOS FET Relay ModuleSPDT moduleG3VM-□M□ T moduleG3VM-□MT Signal RelayG6K/G6J-Y High Frequency RelayUp to 3GHzG6K-RF 8GHzG6K-RF-V
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- 2Electrical test process for devices
- Electrical test for final assembly
USB module test socketXP2U
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- 3I/O board
- Serial communication (i.e.RS232C)
D-sub connectorsXM2/3
- 4Resource card, I/O board
- Signal / power supply connection
MIL connectorsXG2/4/5