vol.249 October 2021

Bringing you the latest information on board design Fresh ON THE BOARD Solutions

As the PCB becomes smaller: PCBs mounted for higher performance and more functions become possible, The smaller product leads to a reduction in cost of materials, processes, and logistics

DesignSmaller & Thinner
Smaller and thinner board needed.

As industrial equipment is required to have higher performance and more functions, the key is "miniaturization and thinness" of PCBs.
Through the supply of small and thin electronic components, OMRON will promote the miniaturization and thinning of your PCBs and contribute to higher performance and multi-functionality of your products.

01 Significant reduction in mounting footprint

DIP Package G3VM-21DR→Ultra-compact MOS FET Relay S-VSON Package G3VM-31QR Reduction of footprint by 90%

02 Thinner by half

B3S→Ultra-thin Tactile Switch B3SE Industry's thinnest level*1 *In 1.6 mm square size. According to OMRON's research in September 2021.

OMRON's lineup of electronic components contributing to smaller and thinner PCBs


MOS FET Relay Module G3VM-□MT Series

  • Low leakage current 1 pA
  • T-shaped circuit configuration in one package

MOS FET Relay G3VM Series

  • SSOP (3.8 x 2.04 x 1.8 mm)
  • USOP (2.85 x 2.2 x 1.65 mm)
  • VSON (2.45 x 1.45 x 1.3 mm)
  • S-VSON (2.0 x 1.45 x 1.65 mm)

Power Relay G6QE

  • Compact and low profile (16 x 30.5 x 20.5 mm) with 250 VAC/36 A switching


Ultra-thin Sealed Surface Mount Tactile Switch B3SE

  • Ultra-thin type with a height of 2 mm
  • IP67 environmental resistance
  • Long life of 1 million cycles

Sealed Ultra Subminiature Basic Switch D2GW-A

  • 8.3 x 5.3 x 6.5 mm (approx. 58% compared to D2AW-A)
  • IP67 environmental resistance


Photomicrosensor SMD Type EE-SX/EE-SY Series

  • Groove width of 2/3/4/5 mm
  • Photo Tr output
  • Photo IC output

* Contents as of September 2021.
In the interest of product improvement, specifications are subject to change without notice

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