The SOLUTIONS - Troubleshoot Case Studies​

Describes the unique characteristics of electronic components, malfunction causes and measures, in an easy-to-understand manner.
It can also be used as a preliminary prevention measure and a primary consultation tool when trouble occurs at any time.

Defect case studies
You can understand specific examples of defects that can be assumed from a particular phenomenon with photos.

Checkpoints for Prevention
Easy-to-understand explanations with illustrations are provided to avoid problems when setting up the product.

A must-have guide for your benefit. We have prepared PDFs for each product, so please download and use them.

＊ In case of a malfunction occurring, please return the part(s) to us as is (do not take it/them apart).

• MOS FET
  Relay
• Mechanical PCB
  Relay Edition
• Micro
  switch
• Operation
  Switch
• Optical
  Sensor

MOS FET Relay

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Contents

• MOS FET Relay - Failure Relationship Diagrams
• MOS FET Relay - Failure Events
• CASE01 Counter-Electromotive Force
• CASE02 Voltage Surge (Input Side)
• CASE03 Ripple voltage
• CASE04 Inrush Current
• CASE05 Output Circuit Design Guideline
• CASE06 Input Circuit Design Guideline
• Photos of Failure Event

Mechanical PCB Relay Edition

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Contents

• Mechanical Relay Defect Primary Investigation Procedure
• CASE01 Buzzing and Vibration (AC Only)
• CASE02 Short Circuit Failure of Diode for Relay Coil Surge Absorber
• CASE03 Abnormal Heat Generation
• CASE04 Layer Short Circuit
• CASE05 Contact Welding
• CASE06 Contact Sticking (Contact Gluing)
• CASE07 Operation Failure due to Flux Penetration
• CASE08 Locking due to Contact Transfer
• CASE09 Contact Failure due to Carbonization
• CASE10 Contact Failure due to Silicone
• CASE11 No Contact Follow
• CASE12 Contact Failure due to Sulphurization or Chlorination
• CASE13 Corrosion
• CASE14 Contact Failure due to the Penetration and Adherence of Foreign Substances (Such as Dust and Insects)
• CASE15 Burn Damage
• CASE16 Wear and Deterioration
• CASE17 Case Holes
• CASE18 Case Swelling
• CASE19 Operation Failure due to Seal Leakage
• Relay Problem Cause Overview

Micro switch

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Contents

• Miniature Basic Switch
  (V, D3V, VX, D2MV, D2RV)
• Subminiature Basic Switch
  (D3M, SS, SS-P, D2S)
• Ultra Subminiature Basic Switch
  (D2LS, D2FS, D2FD, D2F, D2MQ)
• Sealed Basic Switch
  (D2VW, D2SW, D2SW-P, D2HW, D2JW, D2QW)
• Detection Switch
  (D2A, D3C, D2X)
• Reference document

Operation Switch

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Contents

• Tactile Switch [PCB mounted type]
  (B3F, B3M, B3W, B3WN)
• Tactile Switch [Surface mounted type]
  (B3FS, B3U, B3S, B3SN, B3SL)
• Rocker Switch
  (A8L, A8A, A8G, A8GS)
• DIP Switch
  • Slide DIP Switch
    (A6H, A6HF, A6SH, A6SN, A6T, A6TN, A6D, A6E-N)
  • Piano DIP Switch
    (A6HR, A6SR, A6TR, A6DR, A6FR)
  • Rotary DIP Switch
    (A6K / A6K□, A6R / A6R□, A6A,
    A6C / A6CV)
• Reference material

Optical Sensor

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Contents

• CASE1 Malfunction due to circuit design factors
  (Photomicrosensor)
• CASE2 Malfunction due to LED open-circuit failure
  (Photomicrosensor)
• CASE3 Malfunction due to photo IC chip circuit breakage
  (Photomicrosensor)
• CASE4 Malfunction due to external disturbing light
  (Photomicrosensor)
• CASE5 Cracks or fractures in sensor case due to physical deterioration
  (Photomicrosensor)
• CASE6 Element disconnection due to overheating stress
  (Photomicrosensor)
• CASE7 Conductive error due to discoloration of lead terminals
  (Photomicrosensor)
• CASE8 Malfunction due to mutual interference
  (Light convergent/diffuse reflective)
• CASE9 Malfunction due to transparent cover
  (Light convergent/diffuse reflective)
• CASE10 Malfunction due to tilted shiny object
  (Light convergent reflective)