vol.277 February 2024

Bringing you the latest information on board design Fresh ON THE BOARD Product

Color sensor for easy color detection

Development, implementation, and maintenance costs can be reduced.

Color Sensor B5WC L40mm×W8.4mm×H15.9mm
Detection method Development cost Introduction cost Maintenance cost

Conventional camera

High development load

Software development for image processing is required when converting colors, and software modification fees are also required when changing or adding colors.

Over configuration

An MPU with high processing power is required to process camera image data.
This results in high implementation costs and hinders the introduction of color detection solutions.

Huge communication fees

The amount of communication required to send image data to the host is enormous, and communication methods are limited.

Color Sensor

Low development load

No application development is required because the RGB voltage corresponding to the color is output from the sensor when converting colors.

Optimal configuration

Because the sensor handles RGB output voltages, processing by an inexpensive MPU is possible.

Minor communication fees

The sensor separates color into RGB and outputs only the RGB output voltage data, so color detection can be performed with a small amount of communication.

This color sensor is small and can be easily integrated into equipment.

  • Power-supply voltage: 5 V ±5%
  • Digital output: A/D conversion not required on the product side
  • Communication method: I2C
  • Can be mounted from two directions with M3 screws

Low heat generation contributes to equipment miniaturization and high energy efficiency

Miniaturization of equipment by realizing low heat generation

800 VAC/260 A cutoff while reducing heat dissipating parts

General high-capacity power relay

Requires a fan and a heat sink


Low heat generation makes it possible to reduce the need for fans, heat sinks, etc., thus enabling equipment miniaturization

Realization of high energy efficiency

Industry-leading*1 ultra-low contact resistance (0.2 mΩ or less)

General high-capacity power relay

Contact resistance: 0.4 mΩ, Contact temperature: 151.4℃, Temperature rise: 66.4℃

<Simulation conditions>

  • 480 VAC / 200 A
  • Ambient temperature 85°C
  • Use of fans, ducts, and heat sinks
  • One piece installed on a board


Contact resistance: 0.2 mΩ or less, Contact temperature: 132.1℃, Temperature rise: 47.1℃

Improved energy efficiency by suppressing energy loss due to heat generation

*1. According to OMRON's research in July 2021.

* Contents as of January 2024.
In the interest of product improvement, specifications are subject to change without notice

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