vol.287 December 2024

Bringing you the latest information on board design Fresh ON THE BOARD Solutions

Stack in two layers. Heat dissipation.

Development / Design Efficiency / Miniaturization / Multifunctionality
Innovative ideas to reduce board area occupied

When trying to improve the functionality and performance of a product, the number of mounted components increases and the components become larger in size. On the other hand, product and board sizes are limited. This conflicting concern is a perpetual challenge for designers, and there is a constant need to reduce the size of components. However, large-sized components such as MIL connectors and high-capacity relays are essential for improving product functionality and performance, but are difficult to miniaturize. By reducing the mounting area of these components, OMRON contributes to achieving both miniaturization and high functionality.

Reducing the area occupied
by mounted components on the board brings many advantages.

Increase in the number of boards taken

Contributing to production efficiency and cost reduction


Product miniaturization

Contributing to the miniaturization of the device itself by reducing the board area occupied in the device


Multifunctionality and sophistication without changing size

Enabling mounting of new circuits and components in the open space

OMRON has focused on components that have a large impact on area reduction.

MIL connector

About half the conventional mounting area
by stacking in two layers

Conventional (XG4A)
Two right-angle DIP terminals

XG4A
Two-tiered type

Multipolar MIL connector with large footprint. The two-tiered type of XG4A can occupy about half the area.

Flat cable connector
(general-purpose type)
Two-tiered type plug
With a long lock
XG4A-□□39-A/-□□79-A
(With right-angle DIP terminals)


High-capacity relay

Compact type, reducing mounting area

Conventional

G6QG

Comparison with switching load equivalent of general relays 19 to 51% *1

Relay size becomes larger as higher capacity is attempted. The G6QG achieves both high-capacity switching of 480 VAC, 55 A and miniaturization by means of heat dissipation design and structure.

NEW

PCB Power Relay
G6QG




*1. According to OMRON's research in September 2024

* Contents as of November 2024.
In the interest of product improvement, specifications are subject to change without notice

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