Explain soldering precautions for Photomicrosensors.
Refer to Explanation for soldering of built-in type Photomicrosensors.
- Precautions for soldering
Light emitting/receiving elements used in Photomicrosensors are sealed with transparent epoxy resin that transmits light. Since this resin does not contain additives such as glass fibers, it has lower heat resistance and mechanical strength than the black epoxy resin used in general ICs and transistors.
- Perform soldering quickly to reduce temperature stress, taking into account the working environment (temperature/external force) in addition to soldering.
- Take care not to apply external force to the sensor immediately after soldering.
- When attaching a lead wire directly to a lead terminal, do not apply stress to the terminal.
(If there is a risk of stress, take measures such as holding the terminal root.)
- Soldering conditions
Perform implementation under the following conditions unless otherwise specified by the datasheet.
Soldering with lead-free solder is possible under the following working conditions.
* Keep in mind the following conditions:
- The housing material of most Photomicrosensors is polycarbonate, but some models use heat-resistant ABS (e.g. EE-SY169 series).
- For models in which the distance between the caulked part for fixing the element and the bottom surface of the housing (PCB mounting surface) is small, do not allow heat to reach the caulked part above the storage temperature (e.g. EE-SX 1046).
- Do not use non-cleaning flux for actuator models (e.g. EE-SA 105) as it may affect sliding performance.
- When using heat-shrink tubing, ensure that the temperature of the housing does not exceed the storage temperature. Otherwise the housing may melt or the caulking part for fixing an element may be deformed, causing the element to come off.
- Reflow solder
The following models are available as SMD type (e.g. EE-SX1350). Follow the instructions of Implementation Precautions described in the datasheet.
- DO NOT apply external force immediately after soldering
The heat resistance and mechanical strength of Photomicrosensors are lower than those of ICs and transistors due to their physical properties. Take care not to apply external force immediately after soldering (especially dip soldering).
For more information, please see "Photomicrosensors Precautions"
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