vol.249 October 2021
Smaller and thinner board needed.
As industrial equipment is required to have higher performance and more functions, the key is "miniaturization and thinness" of PCBs.
Through the supply of small and thin electronic components, OMRON will promote the miniaturization and thinning of your PCBs and contribute to higher performance and multi-functionality of your products.
01 Significant reduction in mounting footprint
02 Thinner by half
OMRON's lineup of electronic components contributing to smaller and thinner PCBs
MOS FET Relay Module G3VM-□MT Series
MOS FET Relay G3VM Series
Power Relay G6QE
Ultra-thin Sealed Surface Mount Tactile Switch B3SE
Sealed Ultra Subminiature Basic Switch D2GW-A
Photomicrosensor SMD Type EE-SX/EE-SY Series
* Contents as of September 2021.
In the interest of product improvement, specifications are subject to change without notice