If a MOS FET relay and PCB relay(SMD relay) will be mounted on a PCB by reflow soldering, can the same conditions as SMD relays be applied?

Reflow soldering conditions
The soldering conditions are as follows.

[ MOS FET relay ]
If the recommended conditions are exceeded, the performance of the semiconductor used may deteriorate due to heat.
Perform flow soldering within the recommended conditions.

• *1 We recommend that you check the result in your actual operating conditions before use.
• *2 Note that SSOP, USOP, VSON, S-VSON, and P-SON products, if ordered with (TR), will be delivered in a moisture-proof pack with taping packaging. If (TR) is not specified, cut tape products will be delivered in a pack without moisture prevention. If reflow soldering is to be applied to the products, please order them with (TR). Perform manual soldering when mounting the cut tape product. Cut tape products are packed without moisture prevention and are in a state of moisture absorption. If reflow soldering is performed, problems such as package cracking may occur due to heat stress.

[ SMD relay ]

• Since the temperature and time required for SMD relay soldering are lower than those for MOS FET relay soldering, check the solderability of both relays under SMD relay conditions.

For more information, see Common Precautions for All MOS FET Relays: Solder Mounting.

For more information, see Safty Precautions for All Relays: 6-10 Automatic Mounting of Relays for PCBs.

Since the flow soldering is guaranteed only once, it is recommended to check the solderability before mass production.