If a MOS FET relay and PCB relay will be mounted on a PCB by flow soldering, can the same conditions as PCB relays be applied?

Flow soldering conditions

• The soldering conditions are as follows:
  [ MOS FET relay ]
  
  • Preheating: 150°C max., 60 to 120 seconds
  • Soldering temperature: 260°C, within 10 seconds
  • If the recommended conditions are exceeded, the performance of the semiconductor used may deteriorate due to heat.
    Perform flow soldering within the recommended conditions.
  [ PCB relay ]
  
  • Preheating: 110°C max., within 40 seconds
  • Soldering temperature: 260°C, within 5 seconds
• Since the temperature and time required for PCB relay soldering are lower than those for MOS FET relay soldering, check the solderability of both relays under PCB relay conditions.
• Flow soldering can be done only once.

For more information, see Common Precautions for All MOS FET Relays: Solder Mounting

For more information, see Safty Precautions for All Relays: 6-10 Automatic Mounting of Relays for PCBs.

Since the flow soldering is guaranteed only once, it is recommended to check the solderability before mass production.