Print
Product Details Portlet
2SMPB-02B Digital Barometric Pressure Sensor
High accuracy and small size barometric pressure sensor with low current consumption
- Measure barometric pressure and temperature with high accuracy.
- Built in low noise 24 bit ADC.
- Digital control and output via I2C/SPI interface
- Automatically power down non-working circuit
to minimize power consumption. - Individual calibration parameters stored in OTP*
* One Time Programmable - ROM
RoHS Compliant
- English
Datasheet - EnglishSensors Selector Guide
- Japaneseデータシート
- Chinese目录
| Model | 2D/3D CAD | |
|---|---|---|
| 2SMPB-02B | Download | |
Note: This web page provides an excerpt from a datasheet. Refer to Product Datasheet and other applicable documents for more information.
| Structure | Packaging | Model | Minimum Packing Unit |
|---|---|---|---|
| LGA 9pin | Tape and Reel | 2SMPB-02B | 3,500 |
■Absolute Maximum Ratings
■Operating Ratings
■Electrical Characteristics (At Ta = 25°C, VDD = 1.8 V, unless otherwise noted)
| Item | Symbol | Rating | Unit | Remark |
|---|---|---|---|---|
| Power Supply Voltage | Vddmax | 4.0 | V | |
| Input Voltage (other than power) | Vmax | -0.2 to Vopr+0.2 | V | |
| Maximum Pressure | Pmax | 800 | kPa | |
| Storage Temperature | Tstr | -40 to 85 | °C | with no condensation or icing |
| Storage Humidity | Hstr | 10 to 95 | %RH | with no condensation or icing |
| ESD (HBM) | Vhbm | ±2000 | V | |
| ESD (MM) | Vmm | ±200 | V | |
| ESD (CDM) | Vcdm | ±500 | V |
■Operating Ratings
| Item | Symbol | Min.. | Typ.. | Max. | Unit | Remark |
|---|---|---|---|---|---|---|
| Operating Voltage | Vopr | 1.71 | 1.8 | 3.6 | V | VDD |
| Vio | 1.20 | 1.8 | 3.6 | V | VDDIO | |
| Operating Temperature | Topr | －40 | ― | 85 | °C |
■Electrical Characteristics (At Ta = 25°C, VDD = 1.8 V, unless otherwise noted)
| Item | Symbol | Confition | Min. | Typ. | Max. | Unit |
|---|---|---|---|---|---|---|
| Average Current | Ihp | 1 sample/s Forced Mode Ultra High Accuracy | ― | 21.4 | ― | μA |
| Operating Current Consumption | Iddp | Pressure mode | ― | 640 | 800 | μA |
| Iddt | Temperature mode | ― | 410 | 520 | μA | |
| Sleep Mode Current Consumption | Isleep | ― | 1.1 | 2.3 | μA | |
| Measureable Pressure Range | Popr | 30 | ― | 110 | kPa | |
| Absolute Pressure Accuracy | Pabs1 | 90 to 110 kPa, 0 to 40°C | －100 | ― | 100 | Pa |
| Relative Pressure Accuracy | Prel1 | Ultra High Accuracy | ― | ±3.9 | ― | Pa |
| rms Noise | Pnois | Ultra High Accuracy | ― | 1.3 | ― | Pa |
| Absolute Temperature Accuracy | Tabs | 90 to 110 kPa, 0 to 40°C | －2 | ― | 2 | ℃ |
| Pressure Resolution | Pres | ― | 0.06 | ― | Pa | |
| Temperature Resolution | Tres | ― | 0.0002 | ― | ℃ | |
| Power Supply Rejection Ratio (DC) | Ppsrr | 101.3kPa, 0-40℃, 1.71-3.6V Base od VDD = 1.8V | －9.4 | ― | 9.4 | Pa |
| Note: 1. Typical specifications are not guaranteed. Note: 2. The above table shows the characteristics of the Package before soldering. |
（Dimensions:mm）
■Package
■Package
Package Type: LGA (Land Grid Array) 9 pin Package Size: 2.00 × 2.50 × 0.85 mm Material of the terminal surface: Au  |
■Mounting PAD Dimensions
Recommended (Top View)  |
Precautions for Correct Use
●Handling
(1) Only air can be used as pressure media on the product directly. It is prohibited to use pressure media including corrosive gases (e.g.
organic solvents gases, sulfur dioxide and hydrogen sulfide gases), fluid and any other foreign materials.
(2) The products are not water proof. The product shall be kept dry in use excluding the sensor port.
(3) The product shall not be used under dew-condensing conditions. Frozen fluid on sensor chips may cause fluctuation of sensor output
and other troubles.
(4) The product shall be used within rated pressure. Usage at pressure out of the range may cause breakage.
(5) The product may be damaged by static electricity. Charged materials (e.g. a workbench and a floor) and workers should provide
measures against static electricity, including ground connection.
(6) The product shall not be dropped and handled roughly.
(7) The product shall not be used under dusty or damp condition.
(8) Do not wash the print circuit board after the pressure sensor is mounted using solvent. It may cause a mal-function.
(9) Please connect the sensor terminals according to the connection diagram.
(10) The product shall not be used under high-frequency vibration including ultrasonic wave.
(11) This product uses the elastic adhesive for bonding the lid, so do not add excessive stress to the lid.
(12) If soldering is not fit, then this product may catch fire or get hot.
(13) There is a possibility that the peripheral circuit board or some electronic part generates heat while driving this product. Please handle
with care.
(14) Do not tear down this product.
(15) Please do not use the sensor after following case;
- excessive shock added to the terminal of the sensor
- the sensor lid decapped
- the sensor dropped
(16) If you use other conditions described in this document, please check yourself in advance.
organic solvents gases, sulfur dioxide and hydrogen sulfide gases), fluid and any other foreign materials.
(2) The products are not water proof. The product shall be kept dry in use excluding the sensor port.
(3) The product shall not be used under dew-condensing conditions. Frozen fluid on sensor chips may cause fluctuation of sensor output
and other troubles.
(4) The product shall be used within rated pressure. Usage at pressure out of the range may cause breakage.
(5) The product may be damaged by static electricity. Charged materials (e.g. a workbench and a floor) and workers should provide
measures against static electricity, including ground connection.
(6) The product shall not be dropped and handled roughly.
(7) The product shall not be used under dusty or damp condition.
(8) Do not wash the print circuit board after the pressure sensor is mounted using solvent. It may cause a mal-function.
(9) Please connect the sensor terminals according to the connection diagram.
(10) The product shall not be used under high-frequency vibration including ultrasonic wave.
(11) This product uses the elastic adhesive for bonding the lid, so do not add excessive stress to the lid.
(12) If soldering is not fit, then this product may catch fire or get hot.
(13) There is a possibility that the peripheral circuit board or some electronic part generates heat while driving this product. Please handle
with care.
(14) Do not tear down this product.
(15) Please do not use the sensor after following case;
- excessive shock added to the terminal of the sensor
- the sensor lid decapped
- the sensor dropped
(16) If you use other conditions described in this document, please check yourself in advance.
●Environmental conditions for transport and storage
(1) The product shall not be kept with corrosive gases (e.g. organic solvents gases, sulfur dioxide and hydrogen sulfide gases).
(2) The products are not water proof. The product shall be kept dry during storage.
(3) The outer box strength may be degraded depending on the storage conditions. Please use the product in order.
(4) For this product, please keep away from direct sunlight or ultraviolet rays.
(5) The product shall be kept in appropriate conditions of temperature and humidity.
(6) The product shall not be kept under dusty or damp condition.
(2) The products are not water proof. The product shall be kept dry during storage.
(3) The outer box strength may be degraded depending on the storage conditions. Please use the product in order.
(4) For this product, please keep away from direct sunlight or ultraviolet rays.
(5) The product shall be kept in appropriate conditions of temperature and humidity.
(6) The product shall not be kept under dusty or damp condition.
