XH5-N Half-pitch SMT Connectors (Board to Board and Board to Cable Connectors)

Precautions for Correct Use

● Soldering Conditions

・Recommended Reflow Conditions
　Maximum temperature: 260°C
　Time: Within 20 to 40 s

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These conditions, however, depend on the type of solder, the manufacturer, the amount of solder, the size of the circuit board, and the other mounting materials. You must check and select the actual conditions.

● Metal Mask Thickness for Cream Solder Printing

We recommend a metal mask thickness of 0.18 to 0.20 mm for cream solder printing. These conditions, however, depend on the type of solder, the manufacturer, the amount of solder, the size of the circuit board, and the other mounting materials. You must check and select the actual conditions.

● Pin Deformation

The pins will deform if you subject them to an excessive load. Deformed pins will reduce solderability when the Connectors are mounted. Do not drop the Connectors or handle them roughly. Do not connect or disconnect Connectors that are not mounted to a circuit board. Doing so may deform the pins.

● Soldering in an Automatic Solder Bath after Reflow Soldering

To prevent the rise of flux, mask the circuit board positioning boss holes with tape before you perform automatic soldering. If you mount Connectors on the edges of the circuit boards, make sure that the solder surface does not come into contact with the Connectors and that flux does not adhere to contact surfaces.

● Application Precautions

･Confirm that there is no excessive misalignment or inclination in the mating contact portion between the plug and socket before mating the Connector. Make sure that the Connector is mated all the way to the back. If the Connector is not mated all the way to the back, contact reliability may be lost.
･Do not apply an extreme load during Connector insertion or removal. The Connector may be damaged, and contact failure may result. Twist the plug and socket as little as possible when mating the Connector. Not doing so may deform the terminals or housing or crack the housing.
･Do not insert a foreign object, such as tweezers, into the Con- nector mating contact portion. Doing so may cause the plating to peel off or deform the terminals.

● Board Mounting Precautions

Be careful of board warping. Warping that is too severe may cause faulty soldering.

● Storage

(1)Do not store the Connectors in locations subject to dust or high humidity.
(2)Do not store the Connectors in locations close to sources of gasses such ammonia gas or sulfide gas.