4. For BGA
|Pitch||0.4/0.5mm or more|
|Durability||200k cycles or more|
※ Each pin and socket is designed according to the actual customer’s application. Contact us for details.
- (1) Deformation/damage prevention of lead frame. Realized by side contact structure.
- (2) Solder transfer prevention. Realized by wiping motion horizontally to solder surface.