vol.254 March 2022

Bringing you the latest information on board design Fresh ON THE BOARD Product

*Marking may differ from actual products.

Assortment ONBOARD

New 200 V product in non-lead compact high-capacity package P-SON

MOS FET Relay G3VM-201WR P-SON 4-pin,
High-capacity & Low-ON Resistance Type

Continuous load current (peak value)/Load voltage (peak value)

G3VM-WR series in the P-SON package, ideal for use in electrical circuits of equipment requiring miniaturization, has a new high-capacity type with a maximum 200 V lineup. Until now, voltage load switching of 100 VAC required a size larger than the SOP. With the addition of the high-capacity type, however, the P-SON package can now also be used for 100 VAC household outlets. In addition, it is useful for various applications that require high frequency switching and quiet operation.

Applications further expanded with compact, high-capacity P-SON

Factory automation equipment: Semiconductor producing equipment, Automatic semiconductor inspection equipment, Machine tool, Robot controller/Others: Air conditioning equipment, Blind facility

P-SON package contributing to PCB miniaturization

Mounting pad dimensions (recommended values) : SOP4 package (with lead)→P-SON package (no lead) = Mounting area approx. 1/4

The small, no lead model (W 2.1 x L 3.4 x H 1.3 mm) reduces the mounting footprint to approx. 1/4 that of a 4-pin SOP.

0.35 A current-carrying capacity despite its small size

Continuous load current (peak value)/Load voltage (peak value)

With the addition of the 200 V high-capacity type, it can now also be used with a 100 V AC household outlet. Despite its smaller size compared to the SOP 4-pin type, it provides more than 1.5 times higher current-carrying capacity. In addition, the semiconductor relay is silent and does not wear from contact, making it suitable for achieving smartification.

Example: Available up to 100 VAC, 0.35 A (35W)

Wettable flank construction for increased joint strength and image inspection

Solder joint strength, which is an issue for non-lead components, is solved by adopting a wettable flank structure to increase the joint area. The fillet shape is easy to form, making inspection of solder joints easier than with conventional non-lead components.

Conventional non-lead component (cross-section): Smaller joint area (Terminal)/As joints are hidden, image inspection is not possible and X-ray inspection equipment is required. (Solder)→G3VM-□WR (cross-section): Large joint area (Terminal)/Fillets are formed, making image inspection possible (Solder)

* Contents as of February 2022.
In the interest of product improvement, specifications are subject to change without notice

Contact Us