At world R&D Headquarters in Kyoto, Japan, Omron creates new smart
technologies (as seen in compact, lightweight, easy, efficient,
fast, and optimal solutions) that, unlike conventional sensing technologies,
are not limited strictly to data input function, but rather integrate
the areas of sensing & control to output high-value information
for subsequent human or system processing. This sensing & control
expertise forms the concept for the core technologies that have
paved the way for many of OMRON's unique and advanced technologies.
MEMS (Micro Electro-Mechanical Systems)
MEMS Technology At The Heart Of Omron Flow Sensors
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A major advantage of MEMS Flow Sensors is their ability to measure flow speed from 1 mm/s to 40 m/s. To put this into perspective, this covers a range from the fluttering of a butterfly's wings to the roar of a typhoon. At the heart of the MEMS Flow Sensor, there is a tiny sensor element; the Omron MEMS Flow Sensor chip which is only 1.5 mm square by 0.4 mm thick.
Conventional flow sensors use a resistance measurement method based on a natural characteristic that causes the electrical resistance of a material to change due to changes in temperature. This method has a number of disadvantages, though, such as the high cost required for the extremely time-consuming adjustment of the resistance balance.
In contrast the Omron MEMS Flow Sensor, which by the way was the industry's first to apply this technology, utilizes an element called a thermopile that converts thermal energy into electrical energy. This revolutionary method delivered a variety of previously nonexistent advantages, including low-cost operation because there are few adjustments required, low power consumption, and high sensitivity.
The chip’s two sets of thermopiles, located on either side of a tiny heater element, are used to measure the deviations in heat symmetry caused by gas flowing in either direction. A thin layer of insulating film protects the sensor chip from exposure to the gas.
When there is no flow present, temperature distribution concentrated around the heater is uniform and the differential voltage over the two thermopiles is 0V (Diagram1). When even the smallest flow is present, temperature on the side of the heater facing the flow cools, and warms up on the other side of the heater - heat symmetry collapses. The difference of temperature appears as a differential voltage between the two thermopiles, proportional to the mass flow rate.
Diagram 1. Omron was the first manufacturer to utilize thermopile technology to measure flow rate.
Omron’s unique etching technologies (Diagram 2) were used to create a unique shape that gives their flow sensing chip it’s superb characteristics by providing a larger sensing area compared to Conventional Silicon Etching in the same volume. This cavity design enables efficient heating with low power consumption.
To keep the heater temperature above that of the gas being measured, temperature compensating circuitry, which could be described as an “expanded bridge circuit” is incorporated in all Omron flow sensors (except the very economical D6F-V clogged filter/air velocity sensor). This expanded circuit arrangement provides improved temperature characteristics over an ordinary bridge circuit (Diagram 3).
Furthermore, it allows for a factory-adjustable cross point of the temperature characteristic resulting in higher output stability with fluctuating ambient temperatures.
For optimal mass flow readings across the MEMS chip, a uniform, laminar flow through the sensor is highly desirable. Omron’s in-line mass flow sensors, such as the D6F-01/02/03/05/10/20/50 series, incorporate a set of screens in the sensor inlets to accomplish this, resulting in high repeatability. Pulsing flows can also present a problem for mass flow measurement. The D6F-01A/02A series uses an orifice in the outlet side of the sensor to buffer such flows (Diagram 4), often eliminating the need for an external buffer tank.
With the advent of this MEMS technology one must seriously consider taking utilizing these flow sensors. They deliver superior repeatable flow rate measurement, lower applied cost since calibration by the customer is not necessary (they are individually calibrated at the factory), low power consumption and high sensitivity. Omron has a team of experts ready to help you with any of your design challenges. View ALL of Omron's flow sensors by visiting the product page.
Semiconductor Micro Fabrication Technology
Full Set of Services from Development to Manufacturing
OMRON's Minakuchi Factory in Shiga Pref. has the extensive experience in the field of MEMS Foundry for volume manufacturing which enables full set of services from development to manufacturing, and has shipped 25,000k pieces of MEMS products in total by 2006.
In addition, our new foundry (incorporated in April, 2007 in Yasu, Shiga Pref.) possesses Japan's first mass production line for 8 inches.
We have a variety of services to meet requirements from 4-5 inch wafers (with our conventional factory) to 8 inches.
Clean Room for MEMS only - Minakuchi Foundry - Renewed and Expanded in Jan. 2003
Metal Deposition Area
Floor space : 600sqm
Bulk/Surface Micromachining technology and Facilities
In addition to the common processes of manufacturing semiconductors - Bipolar Si Line, CMOS Line, OMRON offers MEMS technology and factory for Bulk Micromachining, such as Anodic Bonding, ECE, Deep RIE, and lines for Glass only, which differentiate from the conventional processes.
OMRON has long time experience in volume production for Anodic Bonding and ECE.
We have the technology and facilities for Surface Micromachining, with Surface MEMS processing and monolithic MEMS processing.
contrast to the two-dimensional structure of integrated
circuits, MEMS technology produces three-dimensional
semiconductor structures with sub-micrometer precision.
These smart structures yield ultra-compact, ultra-fast
devices that help OMRON develop optimal new forms
of sensing & control for the new age.
RF MEMS Switch
RF Switch Based on MEMS Technology
Mechanical RF Switching
Relay Based on MEMS
Combining its long history of
innovative relay products with its
MEMS (Micro Electro Mechanical
System) expertise, Omron has developed
a new RF MEMS Switch to meet the
requirements of the ATE market. Using an
electrostatic drive mechanism, the switch
combines the desirable HF characteristics
of electromechanical relays with a life
expectancy generally only found in solid
state relays. Omron utilizes both 5" and
8" MEMS wafer production lines in its own
Combining Core Competencies and Break-Through Technologies
Omron’s optical subassembly (OSA) products are based on our Afterburner ™
technology that combines patented CWDM designs with proprietary manufacturing techniques to deliver high- performance in tiny, integrated packages. Afterburner
Technology is versatile enough to work in standard packages (e.g. X2, XFP) or custom configurations.
In-House Design Expertise
In-House Manufacturing Expertise
Key Application: High-Definition Video
World’s leading developer and supplier of integrated CWDM products
Primary Factory – Pleasanton, CA
* ONP’s products exceed copper distances by 10x without any quality loss and enable lower cost installation
10 years creating and developing CWDM technologies
Expansion Factory – Kusatsu, Japan
HDMI™, DVI, DisplayPort™ or Proprietary Video
Only manufacturer able to integrate ferrule & lenses into filter-based optics
Eliminates mixing of pixel signals
Capable of standard or custom designs
Scalable architecture to 10 Gbps/Channel
Direct mapping of multiple TMDS signals on a single fiber
SX51M Six Channel Bi-Di
Optical Module - HDMI™ ready
The SX51M is an electrical to
optical conversion module that
enables an HDMITM signal to
be sent uncompressed over
one strand of multimode fiber.
It is a plug-down module
meant to be used with the
customers’ choice of HDMI connector and housing.
• 5 transmit lanes and 1 receive lane over 1 multimode fiber
• Compatible with HDMI™ compliant sources and sinks
• Scalable to HDMI™ 1.3a 16-bit color
• On-board hardware and firmware for HDCP/EDID functionality
• Accepts TMDS inputs directly into its 40 pin plug-down connector
• Automatic laser disable upon fiber disconnect
• Rx Module will receive the optical signal and restore it into its original electrical HDMI™ signal
• Enables rapid design of HDMI™ extension solutions
• The HDCP encoding remains intact and unmodified throughout the entire process
• The SX51 Module converts and transmits an uncompressed HDMI™ video signal, along with the HDCP/EDID functionality,
over distances of up to 1000m, depending on data rate
High-Precision Processing - Electroforming
is widely used where the mechanical process is
not practical due to high resolution and precision
requirement. It copies superfine and complex pattern
When thick plating is done to the surface of the
mother die and the electrodeposited layer flaked
off, the shape which is quite opposite to the
mother die is obtained.
size accuracy is extremely high, and it
is steady. The dimensional error of the
reproduced goods is within ▒1Ám over 100mm,
moreover, the distortion of the surface
is 50Ám or less.
The defect caused by foreign body is extremely
few because of the clean room production.
The side can be transcribed in high accuracy.
Moreover, if the matrix is a mirror finish,
it is possible to use as a mirror finish
without the finish processing. 4) Because
the material is a nickel, hardness is
high and durability is sufficient. It
is possible to use as a mold for molding
Metal mold for liquid crystal display
optical guided-wave devices and metal
mold for non-spherical micro lens